Semiconductor memory device

ABSTRACT

A semiconductor memory device includes a first memory cell, a second memory cell above the first memory cell, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, and a control unit that performs an erasing operation on the first and second memory cells. During the erasing operation, the control unit applies a first voltage to a first word line and a second voltage higher than the first voltage to a second word line.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/174,849, filed Jun. 6, 2016, which is a continuation of U.S. patentapplication Ser. No. 14/469,522, filed Aug. 26, 2014, now U.S. Pat. No.9,361,988, issued Jun. 7, 2016, which is based upon and claims thebenefit of priority from Japanese Patent Application No. 2014-052746,filed Mar. 14, 2014, the entire contents of which are incorporatedherein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor memorydevice.

BACKGROUND

A NAND flash memory in which memory cells are three-dimensionallyarrayed is known.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a memory system according to a firstembodiment.

FIG. 2 is a block diagram of a semiconductor memory device according tothe first embodiment.

FIG. 3 is a circuit diagram of a memory cell array according to thefirst embodiment.

FIG. 4 is a cross-sectional view of the memory cell array according tothe first embodiment.

FIG. 5 is a graph illustrating a threshold value distribution of memorycell transistors according to the first embodiment.

FIG. 6 is a view illustrating zones used during a verification operationof the memory system according to the first embodiment.

FIG. 7 is a flowchart illustrating an erasing operation of the memorysystem according to the first embodiment.

FIG. 8A is a circuit diagram of the memory cell array according to thefirst embodiment.

FIG. 8B is a cross-sectional view of the memory cell transistorsillustrated in FIG. 8A. FIG. 8B shows a cross section taken along lineA-A, a cross section taken along line B-B, a cross section taken alongline C-C, a cross section taken along line D-D, a cross section takenalong line E-E, and a cross section taken along line F-F, in FIG. 4.

FIG. 8C is a graph illustrating a threshold value distribution of thememory cell transistors according to FIG. 8A and FIG. 8B.

FIG. 9 is a graph illustrating a relationship between a voltage, whichis applied to the memory cell transistors according to the firstembodiment, during an erasing operation, and a loop frequency during theerasing operation.

FIG. 10 is a flowchart illustrating an erasing operation of a memorysystem according to a second embodiment.

FIGS. 11A and 11B are graphs illustrating a relationship between avoltage, which is applied to the memory cell transistors according tothe second embodiment, during an erasing operation, and a loop frequencyduring the erasing operation.

FIG. 12A is a circuit diagram of a memory cell array according to athird embodiment. FIG. 12B is a cross-sectional view of memory celltransistors illustrated in FIG. 12A. FIG. 12C is a graph illustrating athreshold value distribution of the memory cell transistors according toFIG. 12A and FIG. 12B.

FIG. 13 is a graph illustrating a relationship between a voltage, whichis applied to the memory cell transistors according to the thirdembodiment, during an erasing operation, and a loop frequency during theerasing operation.

FIGS. 14A and 14B are views illustrating an example of an erasingoperation of a memory system according to a fourth embodiment.

FIGS. 15A and 15B are views illustrating another example of the erasingoperation of the memory system according to the fourth embodiment.

FIG. 16 is a view illustrating an example of an erasing operation of amemory system according to a fifth embodiment.

FIG. 17 is a view illustrating an example of an erasing operation of amemory system according to a sixth embodiment.

FIG. 18 is a cross-sectional view of a memory cell array according to aseventh embodiment.

FIG. 19A is a circuit diagram of the memory cell array according to theseventh embodiment. FIG. 19B is a cross-sectional view of memory celltransistors illustrated in FIG. 19A. FIG. 19C is a graph illustrating athreshold value distribution of the memory cell transistors according toFIG. 19A and FIG. 19B.

FIG. 20 is a graph illustrating a relationship between a voltage, whichis applied to the memory cell transistors according to the seventhembodiment, during an erasing operation, and a loop frequency during theerasing operation.

FIG. 21 is a graph illustrating a relationship between a voltage, whichis applied to memory cell transistors according to Modification Example1 of the seventh embodiment, during an erasing operation, and a loopfrequency during the erasing operation.

FIG. 22 is a graph illustrating a relationship between a voltage, whichis applied to memory cell transistors according to Modification Example2 of the seventh embodiment, during an erasing operation, and a loopfrequency during the erasing operation.

FIG. 23 is a view illustrating an example of an erasing operation of amemory system according to Modification Example 3 of the seventhembodiment.

FIG. 24 is a view illustrating an example of the erasing operation of amemory system according to Modification Example 3 of the seventhembodiment.

FIG. 25 is a view illustrating an example of an erasing operation of amemory system according to Modification Example 4 of the seventhembodiment.

FIG. 26 is a view illustrating an example of an erasing operation of amemory system according to Modification Example 5 of the seventhembodiment.

DETAILED DESCRIPTION

The present embodiment now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areillustrated. In the drawings, the thickness of layers and regions may beexaggerated for clarity. Like numbers refer to like elements throughout.As used herein the term “and/or” includes any and all combinations ofone or more of the associated listed items and may be abbreviated as“/”.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “having,” “includes,” “including” and/or variationsthereof, when used in this specification, specify the presence of statedfeatures, regions, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,regions, steps, operations, elements, components, and/or groups thereof.

It will be understood that when an element such as a layer or region isreferred to as being “on” or extending “onto” another element (and/orvariations thereof), it may be directly on or extend directly onto theother element or intervening elements may also be present. In contrast,when an element is referred to as being “directly on” or extending“directly onto” another element (and/or variations thereof), there areno intervening elements present. It will also be understood that when anelement is referred to as being “connected” or “coupled” to anotherelement (and/or variations thereof), it may be directly connected orcoupled to the other element or intervening elements may be present. Incontrast, when an element is referred to as being “directly connected”or “directly coupled” to another element (and/or variations thereof),there are no intervening elements present.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, materials, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, material, region, layer or section fromanother element, material, region, layer or section. Thus, a firstelement, material, region, layer or section discussed below could betermed a second element, material, region, layer or section withoutdeparting from the teachings of the present invention.

Relative terms, such as “lower”, “back”, and “upper” may be used hereinto describe one element's relationship to another element as illustratedin the Figures. It will be understood that relative terms are intendedto encompass different orientations of the device in addition to theorientation depicted in the Figures. For example, if the structure inthe Figure is turned over, elements described as being on the “backside”of substrate would then be oriented on “upper” surface of the substrate.The exemplary term “upper”, may therefore, encompass both an orientationof “lower” and “upper,” depending on the particular orientation of thefigure. Similarly, if the structure in one of the figures is turnedover, elements described as “below” or “beneath” other elements wouldthen be oriented “above” the other elements. The exemplary terms “below”or “beneath” may, therefore, encompass both an orientation of above andbelow.

Embodiments are described herein with reference to cross sections andperspective illustrations that are schematic illustrations ofembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as flatmay, typically, have rough and/or nonlinear features. Moreover, sharpangles that are illustrated, typically, may be rounded. Thus, theregions illustrated in the figures are schematic in nature and theirshapes are not intended to illustrate the precise shape of a region andare not intended to limit the scope of the present invention.

Provided is a semiconductor memory device that may improve operationalreliability.

In general, according to one embodiment, a semiconductor memory deviceincludes a first memory cell, a second memory cell stacked above thefirst memory cell, a first word line electrically connected to a gate ofthe first memory cell, a second word line electrically connected to agate of the second memory cell, and a control unit that performs anerasing operation on the first and second memory cells. During theerasing operation, the control unit applies a first voltage to the firstword line and a second voltage higher than the first voltage to thesecond word line.

Hereinafter, embodiments configured below will be described withreference to the drawings. In the following description, for componentshaving substantially the same function and configuration are given ofthe same reference numerals and the description will only be repeated,if necessary.

It should be noted that the drawings are schematic and the relationshipbetween the thickness and the plane dimension, the ratio of thethickness of each of layers, or the like are different from reality.Accordingly, specific thickness or dimension, if any, should bedetermined with reference to the following description. In addition, itis natural that a portion, in which the dimensional relationship or theratio is different from each other, is included even between thedrawings.

First Embodiment

A semiconductor memory device according to a first embodiment will bedescribed. Hereinafter, the semiconductor memory device will bedescribed with reference to an example of a three-dimensional stackedNAND flash memory with memory cell transistors stacked above asemiconductor substrate.

Regarding Configuration of Memory System

First, the configuration of a memory system including the semiconductormemory device according to the present embodiment will be described withreference to FIG. 1.

As illustrated in FIG. 1, a memory system 1 includes a NAND flash memory100 and a memory controller 200. The memory controller 200 and the NANDflash memory 100 may be combined with each other to form a singlesemiconductor device. Examples thereof include a memory card such as SD™card, a solid state drive (SSD), or the like.

The NAND flash memory 100 includes a plurality of memory celltransistors (simply referred to as memory cells or the like) and storesdata in a nonvolatile manner. The configuration of the NAND flash memory100 will be described in detail.

The memory controller 200 gives instructions such as “read data from theNAND flash memory 100”, “write data to the NAND flash memory 100”,“erase data from the NAND flash memory 100”, and the like in response toan instruction from outside host device 300. In addition, the memorycontroller 200 manages memory space of the NAND flash memory 100.

The memory controller 200 includes a host interface circuit 210, abuilt-in memory (RAM) 220, a processor (CPU) 230, a buffer memory 240, aNAND interface circuit 250, and an ECC circuit 260.

The host interface circuit 210 is connected to the host device 300 via acontroller bus and conducts communication with the host device 300. Thehost interface circuit 210 transmits instructions and data received fromthe host device 300 to the CPU 230 and the buffer memory 240,respectively. In addition, the host interface circuit 210 transmits datawithin the buffer memory 240 to the host device 300 in response to aninstruction of the CPU 230.

The NAND interface circuit 250 is connected to the NAND flash memory 100via a NAND bus and conducts communication with the NAND flash memory100. The NAND interface circuit 250 transmits an instruction receivedfrom the CPU 230 to the NAND flash memory 100. In addition, duringwriting, the NAND interface circuit 250 transmits write data in thebuffer memory 240 to the NAND flash memory 100. Furthermore, duringreading, the NAND interface circuit 250 transmits data which is readfrom the NAND flash memory 100 to the buffer memory 240.

The CPU 230 controls the overall operation of the memory controller 200.For example, when the CPU 230 receives a writing instruction from thehost device 300, the CPU 230 issues a writing instruction based on theNAND interface circuit 250 in response to the writing instructionreceived from the host device 300. The similar operation is performedduring reading and erasing. In addition, the CPU 230 performs variousprocessings for managing the NAND flash memory 100 such as wearleveling. Furthermore, the CPU 230 performs various arithmeticoperations. For example, the CPU 230 performs encryption processing ofdata, randomizing processing, or the like.

The ECC circuit 260 performs error checking and correcting (ECC) ofdata. That is, the ECC circuit 260 generates a parity based on the writedata during writing data, detects errors by generating a syndrome fromthe parity during reading data, and corrects the errors. The CPU 230 mayalso have the function of the ECC circuit 260.

The built-in memory 220 is a semiconductor memory such as DRAM and isused as a work area of the CPU 230. The built-in memory 220 holdsfirmware for managing the NAND flash memory 100, various managementtables, or the like.

Regarding Configuration of Semiconductor Memory Device

Next, the configuration of the semiconductor memory device 100 accordingto the first embodiment will be described with reference to FIG. 2.

The NAND flash memory 100 includes a core portion 110 and a peripheralcircuit 120 as illustrated in FIG. 2.

The core portion 110 includes a memory cell array 111, a row decoder112, a sense amplifier 113, a fail bit counter circuit 115, and a datalatch circuit 116.

The memory cell array 111 includes a plurality (three in the example ofFIG. 2) of blocks BLK (BLK0, BLK1, . . . ), each of which is acollection of a plurality of nonvolatile memory cell transistorsassociated with word lines and a bit line. The blocks BLK include aplurality of memory cell transistors that share word lines WL. Forexample, data within the same block BLK are erased collectively. Each ofthe blocks BLK includes a plurality of string units SU (SU0, SU1, . . .) which is a set of NAND strings 114 to which the memory celltransistors are connected in series. The number of blocks within thememory cell array 111 and the number of string units within one blockBLK are arbitrary. In the semiconductor memory device 100, the erasureunit is not limited to the block BLK. For example, only a plurality ofstrings may be set as the erasure unit and the string units may be setas the erasure unit.

The row decoder 112 decodes a block address or a page address to make acorresponding block be in a selection state. The row decoder 112 appliesan adequate voltage to select gates of selected string units andnon-selected string units, and selected word lines and non-select wordlines, in accordance with the page address which is selected in aselected block.

The sense amplifier 113 senses or amplifies data read on a bit line fromthe memory cell transistors during reading of the data. In addition, thesense amplifier 113 transmits write data to the memory cell transistorsduring writing of the data. The reading and the writing of the data withrespect to the memory cell array 111 is performed by a plurality ofunits of memory cell transistors and the unit of operation is a page.

The data latch circuit 116 stores a verification result which isdetected by the sense amplifier 113.

The fail bit counter circuit 115 counts the number of bits, for which aprogram operation has not completed successfully, from the verificationresult stored in the data latch circuit 116. The fail bit countercircuit 115 determines whether the program operation passes or fails bycomparing the number of bits, for which the program operation has notcompleted successfully, and the allowed number of failed bits, to informthe determined information to a sequencer 121.

The peripheral circuit 120 includes the sequencer 121, a charge pump122, a register 123, a driver 124, and a counter 125.

The driver 124 supplies a voltage required for the reading, the writing,the erasing of the data to the row decoder 112, sense amplifier 113,fail bit counter circuit 115, a source line driver (not illustrated),and the like. The voltage is applied to the memory cell transistors(word lines, select gate lines, back gate lines, bit lines, and sourcelines which will be described below) through the row decoder 112, thesense amplifier 113, and the source line driver.

The charge pump 122 supplies the required voltage to the driver 124 byboosting a supply voltage applied from the outside.

The register 123 holds various signals. For example, the register 123holds a status of the operation of writing or erasing data, and as aresult, notifies whether or not the operation has successfully completedto the controller. Alternatively, the register 123 may also hold varioustables.

The counter 125 is a register that counts and holds the number of times(loop frequency) the voltage is applied during the erasing.

The sequencer 121 is a control unit that controls the overall operationof the NAND flash memory 100.

Regarding Memory Cell Array

Next, the configuration of the memory cell array 111 according to thefirst embodiment will be described in detail using FIGS. 3 and 4.

The block BLK0 has a plurality of columns in a direction perpendicularto the paper surface as illustrated in FIG. 3. In addition, asillustrated in FIG. 3, the block BLK0 includes, for example, four stringunits SU (SU0 to SU3). In addition, each of the string units SU includesa plurality of NAND strings 114 (see FIG. 2). Other blocks BLK also havethe same configuration as that of the block BLK0.

Each of the NAND strings 114 includes, for example, 48 memory celltransistors MT (MT0 to MT47) and select transistors ST1 and ST2. Thememory cell transistor MT includes a stacked gate containing a controlgate and a charge storage layer, and holds the data in a nonvolatilestate. The number of the memory cell transistors MT is not limited to48. The number of the memory cell transistors MT may be 8, 16, 32, 64,128, or the like. There is no specific restriction on the number thememory cell transistors MT. In addition, the memory cell transistors aresimply referred to as memory cell transistors MT when a particularmemory cell transistor is not referenced.

The memory cell transistors MT are disposed between the selecttransistors ST1 and ST2, with its current path connected in series. Thecurrent path of the memory cell transistor MT47 on one end side of theserial connection is connected to an end of the current path of theselect transistor ST1, and the current path of the memory celltransistor MT0 on the other end side is connected to an end of thecurrent path of the select transistor ST2.

The gates of the select transistors ST1 of the string units SU0 to SU3are respectively connected to the select gate lines SGD0 to SGD3. Thegates of the select transistors ST2 are respectively connected to theselect gate lines SGS0 to SGS3. In contrast to the above, the respectivecontrol gates of the memory cell transistors MT0 to MT47 in the sameblock BLK0 are commonly connected to the word lines WL0 to WL47. Theword lines are simply referred to as word lines WL when a particularword line is not referenced.

That is, the word lines WL0 to WL47 are commonly connected between theplural string units SU0 to SU3 in the same block BLK0. The select gatelines SGD and SGS are set independent in each of the string units SU0 toSU3 even in the same block BLK0.

In addition, among the NAND strings 114 arranged in a matrix shape inthe memory cell array 111, the other ends of the current paths of theselect transistors ST1 of the NAND strings 114 in the same row arecommonly connected to certain one of bit lines BL (BL0 to BL (L−1),where (L−1) represents a natural number of 1 or greater). That is, thebit line BL is commonly connected to the NAND strings 114 between pluralblocks BLK. The other end of the current path of the select transistorST2 is commonly connected to the source lines SL. The source lines SLare commonly connected to the NAND strings 114 between plural blocks,for example.

As described above, the data of the memory cell transistors MT in thesame block BLK may be erased collectively. In contrast to the above, thereading and the writing of the data are carried out collectively for theplural memory cell transistors MT which are commonly connected to acertain word line WL in a certain string unit SU of a certain block BLK.The unit of reading and writing is called a “page”.

Next, a configuration example of the memory cell array 111 will bedescribed in detail with reference to FIG. 4. The structure illustratedin FIG. 4 is arranged in the depth direction (D2 direction) of the page,on which FIG. 4 is drawn, in plural, and the structures share the wordlines WL and the select gate lines SGD and SGS to form a string unit SU.

A peripheral circuit such as the sense amplifier 113 may be formed onthe semiconductor substrate (not illustrated) and the memory cell array111 may be formed on the peripheral circuit. A source line SL31 isformed above the semiconductor substrate.

As illustrated in FIG. 4, an electroconductive film 27 a (for example,polycrystalline silicon films) which functions as the select gate lineSGS is formed above the source line SL31. In addition, a plurality ofelectroconductive films (for example, polycrystalline silicon films) 23which function as the word lines WL are formed on the electroconductivefilm 27 a. Furthermore, an electroconductive film (for example,polycrystalline silicon film) 27 b which functions as the select gateline SGD is formed on the electroconductive films 23. Interelectrodeinsulating films are formed between each of the electroconductive films23, 27 a, 27 b so as to electrically separate each of theelectroconductive films 23, 27 a, 27 b in the D3 direction. Morespecifically, the electroconductive films 23 and the interelectrodeinsulating films are alternately stacked in the D3 direction.

Memory holes, which are extended in the vertical direction (D3direction: direction orthogonal to the D2 direction) with respect to thesurface of the semiconductor substrate, are formed within theabove-described electroconductive films 23, 27 a, 27 b, andinterelectrode insulating films. In the present embodiment, the diameterof the memory holes in a parallel plane in the D1 direction (directionorthogonal to the D2 direction and the D3 direction), and D2 directionis referred to as an MH diameter. In the present embodiment, the memoryholes are formed in a multilayered film which is a stacked structure ofthe electroconductive films 23, 27 a, 27 b, interelectrode insulatingfilms, and the like. In this case, the upper layer area in themultilayered film is more etched compared to the lower layer area. TheMH diameters of the memory holes in the upper layer area are larger thanthe MH diameters of the memory holes in the lower layer area. Thedifference between the MH diameters become larger as the etchingdistance (D3 direction) of the memory hole becomes longer. In the firstembodiment, the memory holes formed in the above-describedelectroconductive films 23 are formed by being divided into two stages,for example. More specifically, first memory holes are formed in theelectroconductive films 23 as the word lines WL0 to WL23, and then,second memory holes are formed in the electroconductive films 23 as theword lines WL24 to WL47.

A block insulating film 25 a, a charge storage layer 25 b, a gateinsulating film 25 c, and a semiconductor layer 26 are sequentiallyformed on the inner wall of the first and the second memory holes, theinner wall being formed in a columnar structure. The semiconductor layer26 functions as a current path of the NAND string 114, and is an area inwhich a channel is formed during the operation of the memory celltransistors MT.

In the present disclosure, the diameter of the columnar structureembedded in the memory hole in the plane parallel to the D1 direction(which is a direction orthogonal to the D2 direction and the D3direction) and the D2 direction is referred to as PS diameter. Inaddition, the length of the PS diameter is expressed as dPS or the like.

Here, the PS diameter in the memory cell transistor MT0 is dPS₀, the PSdiameter in the memory cell transistor MTm (m is an integer from 1 tosmaller than 23) is dPS_(m), (dPS₀<dPS_(m)), and the PS diameter in thememory cell transistor MT23 is dPS₂₃, (dPS₀<dPS_(m)<dPS₂₃). That is, thePS diameter of the memory cell transistor MT sequentially becomes largerfrom the memory cell transistor MT0 to the memory cell transistor MT23(dPS_(i)<dPS_(j) (i<j); and i and j are integers from 0 to 23). Inaddition, the PS diameter in the memory cell transistor MT24 is dPS₂₄,the PS diameter in the memory cell transistor MTn (n is an integer from25 to smaller than 47) is dPS_(n), (dPS₂₄<dPS_(n)), and the PS diameterin the memory cell transistor MT47 is dPS₄₇, (dPS₂₄<dPS_(n)<dPS₄₇). Thatis, the PS diameter of the memory cell transistor MT sequentiallybecomes larger from the MT24 to the MT47 (dPS_(y)<dPS_(z) (y<z); and yand z are integers from 24 to 47). In addition, in the presentembodiment, the dPS₂₃ as the PS diameter of the memory cell transistorMT23 is larger than the dPS₂₄ as the PS diameter of the memory celltransistor MT24.

In the present embodiment, for simplification, the memory celltransistors MT0 and MT24 are shown to have the same PS diameter, thememory cell transistors MTm and MTn are shown to have the same PSdiameter, and the memory cell transistors MT23 and MT47 are shown tohave the same PS diameter. However, it is not necessary that embodimentsare limited to the configuration. For example, the memory celltransistors MT0 and MT24 may not have the same PS diameter.

Furthermore, an electroconductive film 30 b is formed on theelectroconductive film 26 and a bit line layer 33 is formed on theelectroconductive film 30 b.

Regarding Threshold Value Distribution of Memory Cell Transistors

Next, a threshold value distribution of the memory cell transistorsaccording to the present embodiment will be described with reference toFIG. 5. As illustrated in FIG. 5, the memory cell transistors MT mayhold 2-bit data according to the threshold value of the memory celltransistors, for example. The 2-bit data are, for example, an “E” level,an “A” level, a “B” level, and a “C” level in the ascending order of thethreshold value.

The “E” level is a threshold value in a state where the data is erased.For example, the “E” level has a negative value (or may have a positivevalue), and is lower than an erasing verification level (also referredto as a verification level, a verification voltage, or the like) EV. The“A” to “C” levels are threshold values in a state where charge isinjected into the charge storage layer. “A” level is a threshold value,which is higher than a reading level “AR” and is lower than a readinglevel “BR”. The “B” level is a threshold value, which is higher than thereading level “BR” and is lower than a reading level “CR”. The “C” levelis a threshold value which is higher than the reading level “CR.

Each memory cell transistor MT may store the 2-bit data (4-level data)by taking the four threshold value levels.

Regarding Zones

Next, zones used during a verification operation of the memory system 1according to the present embodiment will be described.

As illustrated in FIG. 6, in the first embodiment, the word lines WL0 toWL47 are divided into 6 areas (zones) during the verification operation.In specific, the word lines WL0 to WL7 are set to a zone 0, the wordlines WL8 to WL15 are set to a zone 1, the word lines WL16 to WL23 areset to a zone 2, the word lines WL24 to WL31 are set to a zone 3, theword lines WL32 to WL39 are set to a zone 4, and the word lines WL40 toWL47 are set to a zone 5.

In the memory system 1 according to the first embodiment, for example,the verification voltage is set in each of the zones during theverification operation.

Regarding Erasing Operation of Data

Next, an erasing operation of the memory system 1 according to the firstembodiment will be described with reference to FIGS. 7 to 9.

The erasing operation is an operation of setting a threshold voltage ofthe memory cell transistors MT to a low state. The erasing operationincludes that the sequencer 121 performs voltage application and erasingverification with respect to the memory cell transistors MT.

Step S101

The sequencer 121 applies a voltage VSWL to the word lines WL in orderto perform the erasing operation. Hereinafter, a specific example of anerasing voltage according to the present embodiment will be describedwith reference to FIGS. 4, 8A to 8C, and 9.

As illustrated in FIGS. 4 and 8A to 8C, the PS diameter differs in eachof the memory cell transistors MT. As described above, the relationshipbetween the PS diameters of the memory cell transistors MT0, MTm, andMT23 is dPS₀<dPS_(m)<dPS₂₃. The relationship between the PS diameters ofthe memory cell transistors MT24, MTn, and MT47 is dPS₂₄<dPS_(n)<dPS₄₇.

Here, a method of applying the voltage VSWL to each of the word lines WLwill be described. As described above, the PS diameter differs in eachof the memory cell transistors MT. As a result, the characteristicsdiffer in each of the memory cell transistors MT. For example, the dPS₀as the PS diameter of the memory cell transistor MT0 is smaller than thedPS₁ as the PS diameter of the memory cell transistor MT1. For thisreason, data of the memory cell transistor MT0 is easily erased,compared to that of the memory cell transistor MT1 (erasing rate ishigh). In other words, when the PS diameter of the memory celltransistor MT is small, the data is easily erased (erasing rate ishigh). When the PS diameter of the memory cell transistor MT is large,the data is not easily erased (erasing rate is low). In the presentembodiment, an adequate voltage VSWL is selected in each of the wordlines WL to be applied. In specific, the sequencer 121 makes the valueof a voltage VSWL_WL0, which is applied to the word line WL0corresponding to the memory cell transistor MT0, larger than that of avoltage VSWL_WL1, which is applied to the word line WL1 corresponding tothe memory cell transistor MT1 (VSWL_WL0>VSWL_WL1). Similarly, thevoltage VSWL is set to be small sequentially from the memory celltransistor MT0 to the memory cell transistor MT23 (VSWL_WL0>VSWL_> . . .>WL1 VSWL_WLm> . . . >VSWL_WL23).

The voltage VSWL_WL23 which is applied to the word line WL23corresponding to the memory cell transistor MT23 is set to be smallerthan the voltage VSWL_WL24_which is applied to the word line WL24corresponding to the memory cell transistor MT24. This is because thedPS₂₃ as the PS diameter of the memory cell transistor MT23 is largerthan the dPS₂₄ as the PS diameter of the memory cell transistor MT24.

The sequencer 121 makes the value of voltage VSWL_WL24(VSWL_WL24=VSWL_WL0> . . . >VSWL_WL23), which is applied to the wordline WL24 corresponding to the memory cell transistor MT24, larger thanthat of voltage VSWL_WL25, which is applied to the word line WL25corresponding to the memory cell transistor MT25 (VSWL_WL24>VSWL_WL25).Similarly, the voltage VSWL is set to be small sequentially from thememory cell transistor MT24 to the memory cell transistor MT47(VSWL_WL24>VSWL_WL25> . . . >VSWL_WLn> . . . >VSWL_WL47=VSWL_WL23).

The erasing voltage is applied in accordance with the PS diameter of thememory cell transistor MT in this manner.

Step S102

As illustrated in the following Steps S102 to S106, for example, thesequencer 121 performs erasing verification in each of theabove-described zones after performing block erasing. First, thesequencer 121 selects a zone 0 (i=0) as a zone i (i is an integer of 0or greater) and performs the erasing verification.

Step S103

The sequencer 121 confirms whether the word line WLi already passed theerasing verification.

Step S104

In Step S104, the sequencer 121 performs the erasing verification withrespect to the zone i when it is determined that the zone i has notpassed the erasing verification yet.

Step S105

The sequencer 121 determines whether the zone i is the last zone in theblock in which the erasing is performed.

Step S106

The sequencer 121 replaces i with i+1 and performs Steps S103 to S105again when the sequencer 121 determines that the zone i is not the lastzone in the block in which the erasing is performed.

Step S107

In Step S107, the sequencer 121 determines whether all of the zones inthe block to be erased pass the erasing verification or not when it isdetermined that the zone is the last zone in that block in which theerasing is performed.

Here, when the sequencer 121 determines that all of the zones in theblock to be erased have not passed the erasing verification, the processreturns to Step S101.

When the process returns to Step S101, in order to perform the erasingoperation, the sequencer 121 applies voltage VSWL or voltage VUWL(VUWL>VSWL)) to respective word lines WL so as not to erase a word lineWL that already passed the erasing verification and to erase a word lineWL that has not passed the erasing verification yet.

The sequencer 121 finishes the block erasing when it is determined thatall of the zones in the block to be erased pass the erasingverification.

As illustrated in FIG. 8A to FIG. 8C, the variation of the erased level(“E” level) is suppressed in the memory cell transistors MT0 to MT47that respectively have different PS diameters by performing theabove-described erasing operation.

Effect of First Embodiment

As described above, according to the memory system according to thefirst embodiment, the dPS₁ as the PS diameter of the memory celltransistor MT1 formed on the memory cell transistor MT0 is larger thanthe dPS₀ as the PS diameter of the memory cell transistor MT0. In thepresent embodiment, the PS diameter sequentially becomes larger from thememory cell transistor MT0 to the memory cell transistor MT23. However,the dPS₂₄ as the PS diameter of the memory cell transistor MT24 formedon the memory cell transistor MT23 is smaller than the dPS₂₃ as the PSdiameter of the memory cell transistor MT23. The PS diametersequentially becomes larger from the memory cell transistor MT24 to thememory cell transistor MT47.

The sequencer 121 according to the present embodiment applies word lineWL-applying voltage to each of the word lines WL0 to WL47 during theerasing operation in accordance with the differences of the PS diametersof the memory cell transistor MT.

The sequencer 121 according to the present embodiment makes a voltageVSWL, which is applied to a word line WL of a memory cell transistor MT,larger as the PS diameter of the memory cell transistor MT is smallerduring the erasing operation. Moreover, the sequencer 121 makes avoltage VSWL, which is applied to a word line WL of a memory celltransistor MT, smaller as the PS diameter of the memory cell transistorMT is larger during the erasing operation.

Accordingly, it is possible to arrange the erased level after theerasing operation in the memory cell transistors MT that have differentPS diameters from each other.

It is possible to suppress the variation of the erased level (“E” level)after the erasing operation in the memory cell transistors MT in whichthe erasing rate is different from each other as a result of havingdifferent PS diameters as illustrated in FIG. 8A to FIG. 8C, byperforming the erasing operation as described in the first embodiment.As a result, it is possible to suppress any excessive erasing in memorycell transistor MT having a small PS diameter (high erasing rate) asdescribed in conjunction with FIG. 8A to FIG. 8C.

In other words, according to the erasing operation described in thefirst embodiment, it is possible to suppress any deterioration or thelike of the memory cell transistors MT by applying different voltagesVSWL based on the PS diameter between the layers. As a result, it ispossible to provide a high-quality memory system 1.

According to the above-described first embodiment, the processing duringthe formation of the NAND strings 114 is divided into two stages.However, the number of times of processing is not limited thereto, andthe NAND strings 114 may be formed through one processing step and maybe formed through three or more processing steps.

Second Embodiment

Next, an erasing operation of the memory system 1 according to a secondembodiment will be described. The erasing operation according to thesecond embodiment is different from that according to the firstembodiment in that the voltage VSWL applied to a predetermined word lineWL increases after desired number of times of the erasing operation isrepeated. The basic configuration or the like of the memory system 1according to the second embodiment is the same as that of the memorysystem 1 according to the above-described first embodiment, andtherefore, the detailed description thereof will be omitted.

Regarding Erasing Operation of Data of Second Embodiment

An erasing operation of the memory system 1 according to the secondembodiment will be described with reference to FIGS. 10 to 11B.

Step S201

The sequencer 121 applies an erasing voltage to the bit lines BL andapplies a voltage to word lines WL. The sequencer 121 subsequentlyperforms the erasing verification with respect to the word lines WL0 toWL47, for example.

In the second embodiment, the voltage VSWL applied to the word lines WLin Step S201 is the same as the voltage VSWL described in Step S101 ofFIG. 7 according to the above-described first embodiment.

Step S202

The sequencer 121 determines whether or not all of the zones in theblock to be erased pass the erasing verification. Here, the processenters Step S203 when the sequencer 121 determines that all of the zonesin the block to be erased have not passed the erasing verification.

The sequencer 121 completes the block erasing operation when it isdetermined that all of the zones in the block to be erased pass theerasing verification.

Step S203

The sequencer 121 determines whether or not the application of theerasing voltage on the bit lines BL and the voltage VSWL on the wordlines WL, and the erasing verification are performed a firstpredetermined number of times. The process returns to Step S201 when thesequencer 121 determines that the application of the erasing voltage onthe bit lines BL and the voltage VSWL on the word lines WL, and theerasing verification are not performed a first predetermined number oftimes. The loop of the application of the erasing voltage on the bitlines BL and the voltage VSWL on the word lines WL, and the erasingverification (erasing operation) is counted by the counter 125 or thelike. The sequencer 121 performs the above-described determination byreferring to the counter 125.

Step S204

The sequencer 121 increases the voltage VSWL for the predetermined wordline WL when it is determined that the application of the erasingvoltage on the bit lines BL and the voltage VSWL on the word lines WL,and the erasing verification have been performed the first predeterminednumber of times.

As described above, data is easily erased as the PS diameter of thememory cell transistor MT is smaller. Therefore, the voltages VSWL_WL0and VSWL_WL24 for word lines WL (for example, WL0, WL24, and the like)that belong to memory cell transistors MT (for example, MT0, MT24, andthe like) having a small PS diameter increases as illustrated in FIGS.11A and 11B. The increased voltage may be variously changed as long asthe voltage is a voltage (for example, voltage VUWL (VUWL>VSWL) withwhich the memory cell transistor MT is not easily erased. In addition,in Step S204, although only the two word lines such as WL0 and WL24 aredescribed as increased word lines WL, embodiments are not limitedthereto and various modifications may be appropriately made.

Step S205

The sequencer 121 performs erasing operation the same as that in StepS201 after increasing the voltage VSWL of the predetermined word line WLin Step S205.

Step S206

The sequencer 121 determines whether or not the erasing operation isperformed the second predetermined number of times (first predeterminednumber of times<second predetermined number of times (loop max)) byreferring to the counter 125 or the like. The process returns to StepS205 when the sequencer 121 determines that the erasing operation is notperformed the second predetermined number of times.

Step S207

The sequencer 121 determines whether all of the zones in the block to beerased pass the erasing verification when it is determined that theerasing operation is performed the second predetermined number of timesin Step S206.

Here, the sequencer 121 determines that the erasing operation of theblock to be erased failed when it is determined that all of the zones inthe block to be erased have not passed the erasing verification.

In addition, the sequencer 121 finishes the block erasing operation whenit is determined that all of the zones in the block to be erased passthe erasing verification.

Effect of Second Embodiment

As described above, according to the memory system according to thesecond embodiment, the sequencer 121 increases the voltage VSWL for theword lines WL that belong to memory cell transistors MT having a smallPS diameter after performing the erasing operation a predeterminednumber of times.

It is possible to suppress any excessive erasing by performing such anerasing operation. As a result, it is possible to provide a high-qualitymemory system 1 that may suppress any deterioration or the like of thememory cell transistors MT.

The second embodiment may be applied even to the above-described firstembodiment.

In addition, in the second embodiment, the sequencer 121 may increase avoltage VSWL for a first word line WL when it is determined that theerasing operation is performed the first predetermined number of times.Furthermore, the sequencer 121 may increase a voltage VSWL for a secondword line WL when it is determined that the erasing operation isperformed the second predetermined number of times.

In the second embodiment, as illustrated in FIG. 11B, the sequencer 121may increase the voltage VSWL for the word line WL that belongs to thememory cell transistor MT having a small PS diameter in a step-up mannerevery time the erasing operation performs a predetermined number oftimes.

Third Embodiment

Next, an erasing operation of the memory system 1 according to a thirdembodiment will be described. The erasing operation according to thethird embodiment is different from those according to the first and thesecond embodiments in that different verification levels are set in eachof the zones, and the sequencer 121 detects the pass of the erasingverification of the memory cell transistor MT having a small PS diameter(high erasing rate) and increases the voltage VSWL for the word line WLthat belongs to the passed memory cell transistor MT. The basicconfiguration or the like of the memory system 1 according to the thirdembodiment is the same as that of the memory system 1 according to theabove-described first embodiment, and therefore, the detaileddescription thereof will be omitted.

Regarding Erasing Operation of Data of Third Embodiment

An erasing operation of the memory system 1 according to the thirdembodiment will be described with reference to FIGS. 12A, 12B, 12C and13.

Step S301

The sequencer 121 performs an erasing operation the same as the erasingoperation described in Step S201 of FIG. 10 according to theabove-described first embodiment.

Step S302

However, in the memory system 1 according to the present embodiment,different verification levels are set in each of the zones based on thePS diameter of the memory cell transistor MT.

As illustrated in FIG. 12A to FIG. 12C, in the memory system 1 accordingto the present embodiment, a verification level EV1 is set to a zone 0to which the memory cell transistors MT0 to MT7 belong and to a zone 3to which the memory cell transistors MT24 to MT31 belong. In addition,in the memory system 1, a verification level EV2 (EV1>EV2) is set to azone 1 to which the memory cell transistors MT8 to MT15 belong and to azone 4 to which the memory cell transistors MT32 to MT39 belong. Inaddition, in the memory system 1, a verification level EV3 (EV1>EV2>EV3)is set to a zone 2 to which the memory cell transistors MT16 to MT23belong and to a zone 5 to which the memory cell transistors MT40 to MT47belong.

Here, a case where the three verification levels are prepared as theverification levels assigned to the memory cell transistors MT will bedescribed. The number of the verification levels is not limited thereto,and any number of the verification levels may be prepared as long as thenumber of the verification levels is 2 or more.

The sequencer 121 determines whether or not a zone to which theverification level (EVL1) is set to pass the erasing verification. Thesequencer 121 repeats the operation in Step S301 when it is determinedthat a zone to which the verification level (EVL1) is set has not passedthe erasing verification.

Step S303

The sequencer 121 increases a voltage VSWL for a word line WL of amemory cell transistor MT that belongs to the zone to which theverification level (EVL1) is set as illustrated in FIG. 13 when it isdetermined that the zone to which the verification level (EVL1) is setto pass the erasing verification.

More specifically, the sequencer 121 increases voltages VSWL_WL0 andVSWL_WL24 for word lines WL (for example, WL0, WL24, and the like) thatbelong to memory cell transistors MT (for example, MT0, MT24, and thelike) having a small PS diameter. The increased voltage may be variouslychanged as long as the voltage is a voltage (for example, voltage VUWL(VUWL>VSWL)) with which the memory cell transistor MT is not easilyerased. In addition, in Step S303, although only the two word lines suchas WL0 and WL24 are described as increased word lines WL, embodimentsare not limited thereto and various modifications may be appropriatelymade.

Step S304

The sequencer 121 performs an erasing operation the same as that in StepS301 after increasing the voltage VSWL of the predetermined word line WLin Step S303.

Step S305

The sequencer 121 determines whether or not all of the zones in theblock to be erased pass the erasing verification.

Here, the sequencer 121 repeats the operation in Step S304 when it isdetermined that all of the zones in the block to be erased have notpassed the erasing verification.

The sequencer 121 finishes the block erasing operation when it isdetermined that all of the zones in the block to be erased pass theerasing verification.

Effect of Third Embodiment

As described above, according to the memory system according to thethird embodiment, different verification levels are set in each of thezones. Moreover, the sequencer 121 increases the voltage VSWL for theword lines WL that belong to memory cell transistors MT that belong tothe zones when zones, in which the verification level (EVL1) is set,pass the verification.

It is possible to suppress any excessive erasing in memory celltransistors MT having a small PS diameter similarly to theabove-described second embodiment by performing such an erasingoperation. As a result, it is possible to suppress any deterioration orthe like of the memory cell transistors MT, thereby providing ahigh-quality memory system 1.

The third embodiment may be applied even to the above-described firstand second embodiments.

Fourth Embodiment

Next, an erasing operation of the memory system 1 according to a fourthembodiment will be described. The basic configuration or the like of thememory system 1 according to the fourth embodiment is the same as thatof the memory system 1 according to the above-described firstembodiment, and therefore, the detailed description thereof will beomitted.

Regarding Erasing Operation of Data of Fourth Embodiment

An erasing operation of the memory system according to the fourthembodiment will be described with reference to FIGS. 14A to 15B.

As illustrated in FIGS. 14A to 15B, in the fourth embodiment, the wordlines WL0 to WL47 are divided into 6 areas (zones). More specifically,the word lines WL0 to WL7 are set to a zone 0, the word lines WL8 toWL15 are set to a zone 1, the word lines WL16 to WL23 are set to a zone2, the word lines WL24 to WL31 are set to a zone 3, the word lines WL32to WL39 are set to a zone 4, and the word lines WL40 to WL47 are set toa zone 5. However, as described in the first embodiment, the PS diameterbecomes larger from the word line WL0 to the word line WL23. Inaddition, the PS diameter becomes larger from the word line WL24 to theword line WL47.

As illustrated in FIGS. 14A and 14B, in the memory system 1 according tothe fourth embodiment, for example, the voltage VSWL is set in each ofthe zones during the erasing operation. For example, a higher voltageVSWL than a voltage VSWL applied to the zone 2 is applied to the zones 0and 1. In addition, a higher voltage VSWL than a voltage VSWL applied tothe zone 5 is applied to the zones 3 and 4.

More specifically, in FIGS. 14A and 15B, the voltage VSWL in the zones0, 1, 3, and 4 is set to 2 V and the voltage VSWL in the zones 2 and 5is set to 0.5 V, for example.

In addition, as illustrated in FIGS. 15A and 15B, in the memory system 1according to the fourth embodiment, for example, a higher voltage VSWLthan a voltage VSWL applied to the zones 1 and 2 is applied to the zone0 during the erasing operation. In addition, a higher voltage VSWL thana voltage VSWL applied to the zones 4 and 5 is applied to the zone 3.

More specifically, in FIGS. 14A and 14B, the voltage VSWL in the zones 0and 3 is set to 2 V and the voltage VSWL in the zones 1, 2, 4 and 5 isset to 0.5 V, for example.

Effect of Fourth Embodiment

As described above, according to the memory system according to thefourth embodiment, the voltage VSWL is set in each of the areas (zones)of the word lines WL.

As described above, it is possible to obtain an effect the same as thataccording to the first embodiment using a pump driver which is smallercompared to that in the method of controlling the voltage VSWL in eachof the word lines WL, by controlling the voltage VSWL in each of thezones. As a result, it is possible to provide a high-quality memorysystem 1 which may suppress any deterioration or the like of the memorycell transistors MT.

According to the above-described fourth embodiment, six zones areprepared. However, embodiments are not limited thereto, and any numberof zones may be fine as long as the group of the memory cell transistorsMT having a small PS diameter may be distinguished from the group of thememory cell transistors MT having a large PS diameter. In addition, themethod of defining the zones may be variously changed. Furthermore,although the voltage applied to each wiring is clearly specified in theabove-described fourth embodiment, the specification is merely anexample. Moreover, the voltage VSWL applied to each zone or the voltageapplied to each wiring may be variously changed. The same principle alsoapplies to other embodiments.

The fourth embodiment may be applied even to the above-described secondand third embodiments.

In addition, FIGS. 14A and 15A shows a three-dimensional stacked NANDflash memory that performs erasing by using Gate-Induced-Drain-Leakagecurrent (GIDL). However, as illustrated in FIGS. 14B and 15B, theprinciple may also be applied to a three-dimensional stacked NAND flashmemory that performs erasing of a well. The well erasing method isdescribed in U.S. Patent Application Pub. No. 2012/0243338, the entirecontents of which are incorporated by reference herein.

In addition, the above-described definition of the zones is merely anexample and may be appropriately changed without being limited thereto.

Fifth Embodiment

Next, an erasing operation of the memory system 1 according to a fifthembodiment will be described. In the fifth embodiment, the word lines WLare divided into predetermined areas (zones) and the erasing operationis performed in each of the zones. The erasing operation of the fifthembodiment is different from those of the first to fourth embodiments inthat the setting of the bit lines BL is changed in accordance with thezones performing the erasing operation which is performed at differenttimings. The basic configuration or the like of the memory system 1according to the fifth embodiment is the same as that of the memorysystem. 1 according to the above-described first embodiment, andtherefore, the detailed description thereof will be omitted.

Regarding Erasing Operation of Data of Fifth Embodiment

An erasing operation of the memory system according to the fifthembodiment will be described with reference to FIG. 16. As illustratedin FIG. 16, in the fifth embodiment, the word lines WL0 to WL47 aredivided into 6 areas (zones) similarly to the fourth embodiment. Themethod of defining the zones is the same as that in the fourthembodiment, and therefore, the description thereof will be omitted.

In the erasing operation of the memory system 1 according to the fifthembodiment, application of the voltage VSWL is divided into two stages.In specific, as illustrated in FIG. 16, the sequencer 121 first appliesan erasing voltage (23 V) to the bit lines BL, applies a voltage VUWL (7V) to zones to which memory cell transistors MT having a high erasingrate (small PS diameter) belong, and applies a voltage VSWL (0.5 V) tozones to which memory cell transistors MT having low erasing rate (largePS diameter) belong (first pulse). Subsequently, the sequencer 121reduces the erasing voltage applied to the bit lines BL (to 21 V) beingless than the first voltage, applies a voltage VSWL (0.5 V) to zones towhich memory cell transistors MT having a small PS diameter belong, andapplies a voltage VUWL (7 V) to zones to which memory cell transistorsMT having large PS diameter belong (second pulse). Then, the sequencer121 performs the erasing verification.

Effect of Fifth Embodiment

As described above, according to the memory system according to thefifth embodiment, the data of the memory cell transistors MT having alow erasing rate is first erased earlier than the memory celltransistors MT having a high erasing rate. In specific, the word linesWL are divided into areas (zones) to erase the divided zones atdifferent timings. Moreover, it is possible to reduce the potentialdifference in the memory cell transistors MT having a small PS diameterby reducing the voltage for the bit lines when the voltage VSWL isapplied to the zones to which the memory cell transistors MT having asmall PS diameter belong, compared to when the voltage VSWL is appliedto the zones to which the memory cell transistors MT having a large PSdiameter belong.

Accordingly, similarly to the above-described fourth embodiment, it ispossible to suppress any variation of the erased level and any excessiveerasing in the memory cell transistors MT having different PS diametersduring easily controlling the voltage VSWL, compared to when controllingthe voltage VSWL in each of the word lines WL. As a result, it ispossible to provide a high-quality memory system 1 that may suppress anydeterioration or the like of the memory cell transistors MT.

In the erasing operation of the memory system 1 according to theabove-described fifth embodiment, although the application of thevoltage VSWL is performed by being divided into two stages, theapplication thereof may be divided into three or more stages withoutbeing limited thereto.

In addition, in the erasing operation of the memory system 1 accordingto the above-described fifth embodiment, although a voltage VSWL isapplied to the group of the memory cell transistors MT having a large PSdiameter in the first pulse and a voltage VSWL is applied to the groupof the memory cell transistors MT having a small PS diameter in thesecond pulse, embodiments are not limited thereto. More specifically,during the operation of applying the voltage VSWL, the voltage VSWL maybe applied to the zones to which the memory cell transistors MT having asmall PS diameter and the voltage VUWL may be applied to the zones towhich the memory cell transistors MT having a large PS diameter, as thefirst pulse, and the voltage VUWL may be applied to the zones to whichthe memory cell transistors MT having a small PS diameter and thevoltage VSWL may be applied to the zones to which the memory celltransistors MT having a large PS diameter, as the second pulse.

In addition, during the erasing operation of the above-described fifthembodiment, the voltage to be applied to the bit lines BL may beappropriately changed as long as a value of the voltage is selected inthe range where no excessive erasing occurs during the erasing operationof the memory cell transistors MT having a small PS diameter. Forexample, The sequencer 121 may apply the voltage VSWL on the group ofthe memory cell transistors MT having a small PS diameter in the firstpulse and may increase the voltage, which is applied to the bit lines BLduring the second pulse of the operation of applying the voltage VSWL,more than the voltage during the first pulse, when applying the voltageVSWL to the memory cell transistors MT having a large PS diameter in thesecond pulse.

In addition, although the voltage VUWL is set to 7 V in theabove-described fifth embodiment, there is no restriction on the voltageVUWL. Similarly, the voltage VSWL is set to 0.5 V therein, but there isno restriction on the voltage VSWL.

In addition, the fifth embodiment may be applied even to theabove-described first to third embodiments.

Sixth Embodiment

Next, an erasing operation of the memory system 1 according to a sixthembodiment will be described. The erasing operation according to thesixth embodiment is different from those according to the first to fifthembodiments in that the word lines WL are divided into predeterminedareas (zones) and data of the group of the memory cell transistors MThaving a small PS diameter and data of the group of the memory celltransistors MT having a large PS diameter are erased under differentvoltage conditions and at different timings. The basic configuration orthe like of the memory system 1 according to the sixth embodiment is thesame as that of the memory system 1 according to the above-describedfirst embodiment, and therefore, the detailed description thereof willbe omitted.

Regarding Erasing Operation of Data of Sixth Embodiment

An erasing operation of the memory system according to the sixthembodiment will be described with reference to FIG. 17.

As illustrated in FIG. 17, in the sixth embodiment, the word lines WL0to WL47 are divided into 6 areas (zones) similarly to the fourthembodiment. The method of defining the zones is the same as that in thefourth embodiment, and therefore, the description thereof will beomitted.

In the erasing operation of the memory system 1 according to the sixthembodiment, application of the voltage VSWL is divided into two stages.In specific, as illustrated in FIG. 17, the sequencer 121 first appliesa voltage VUWL (7 V) to the zones 0, 1, 3, and 4, and applies a voltageVSWL (0.5 V) to zones 2 and 5 (first pulse). Subsequently, the sequencer121 applies a voltage VSWL (1.5 V), which is higher than the voltageVSWL (0.5 V) in the first pulse, to the zones 0, 1, 3, and 4, andapplies the voltage VUWL (7 V) to zones 2 and 5 (second pulse). Then,the sequencer 121 performs the erasing verification.

Effect of Sixth Embodiment

As described above, according to the memory system according to thesixth embodiment, the word lines WL are divided into predetermined areas(zones) to erase the divided zones at different timings. Moreover, it ispossible to reduce the stress in the memory cell transistors MT having asmall PS diameter by increasing the voltage VSWL when the voltage VSWLis applied to the zones to which the memory cell transistors MT having asmall PS diameter belong, compared to when the voltage VSWL is appliedto zones to which the memory cell transistors MT having a large PSdiameter belong. Accordingly, it is possible to provide a high-qualitymemory system 1 similarly to the first embodiment.

The sixth embodiment may be applied even to the second, third, and fifthembodiments. In addition, although 6 zones are set in the sixthembodiment, the number of zones are not limited thereto and may bevariously changed as long as the memory cell transistors MT having asmall PS diameter is distinguishable from the memory cell transistors MThaving a large PS diameter.

Although a voltage VSWL of 0.5 V is applied to the zones 2 and 5 and avoltage VSWL of 1.5 V is applied to the zones 0, 1, 3, and 4 during theerasing operation in the sixth embodiment, the voltage VSWL is notlimited thereto and may be variously changed as long as the voltage VSWLapplied to the zones, to which the memory cell transistors MT having asmall PS diameter belong, is higher than the voltage VSWL applied to thezones, to which the memory cell transistors MT having a large PSdiameter belong.

Seventh Embodiment

Next, a seventh embodiment will be described. In the seventh embodiment,the shape of the memory cell array 111 is different from those of thememory cell arrays 111 according to the first to the fifth embodiments.The basic configuration or the like of the memory system 1 according tothe seventh embodiment is the same as that of the memory system. 1according to the above-described first embodiment, and therefore, thedetailed description thereof will be omitted.

Regarding Memory Cell Array of Seventh Embodiment

The memory cell array according to the seventh embodiment will bedescribed with reference to FIG. 18.

The structure illustrated in FIG. 18 is arranged in the D2 direction inplural, and the structures share the word lines WL, the select gatelines SGD and SGS, and the back gate lines BG to form a string unit SU.

As illustrated in FIG. 18, a peripheral circuit such as the senseamplifier 113 is formed on the semiconductor substrate and the memorycell array 111 is formed on the peripheral circuit, for example. Thatis, as illustrated in FIG. 18, an electroconductive film (for example,polycrystalline silicon layers) 41 which functions as the back gate lineBG is formed above the semiconductor substrate. Furthermore,electroconductive films (for example, polycrystalline silicon layers) 43which function as the word lines WL are formed on the electroconductivefilm 41. Furthermore, the electroconductive films (for example,polycrystalline silicon layers) 47 a and 47 b which function as theselect gate lines SGD and SGS are formed on the electroconductive films43.

Moreover, memory holes (not illustrated) are formed within theabove-described electroconductive films 47 a, 47 b, and 43. A blockinsulating film 45 a, a charge storage layer (insulating film) 45 b, anda gate insulating film 45 c are sequentially formed on the inner wall ofthe memory holes, and an electroconductive film 46 is further embeddedin the memory hole. The electroconductive film 46 functions as a currentpath of the NAND string 114, and is an area in which a channel is formedduring the operation of the memory cell transistors MT.

Furthermore, the electroconductive films 50 a and 50 b are formed on theelectroconductive film 46, a source line layer 51 is formed on theelectroconductive film 50 a and a bit line layer 53 is formed on theelectroconductive film 50 b via the electroconductive film 52.

As is also described in the first embodiment, the upper layer area ismore etched compared to the lower layer area when the memory holes areformed in a multilayered film. Therefore, the MH diameters of the memoryholes in the upper layer area are larger than the MH diameters of thememory holes in the lower layer area.

Here, for example, a PS diameter dPS₀ in the memory cell transistor MT0is larger than a PS diameter dPS₁ in the memory cell transistor MT1(dPS₀>dPS₁). In addition, the PS diameter dPS_(s) (dPS₀>dPS₁>dPS_(s)) inthe memory cell transistor MTs (s is an integer from 2 to smaller than23) is larger than a PS diameter dPS_(s+1) (dPS₀>dPS₁>dPS_(s)>dPS_(s+1))in the memory cell transistor MT_(s+1). In addition, a PS diameter dPS₂₂(dPS₀>dPS₁>dPS_(s)>dPS_(s+1)>dPS₂₂) in the memory cell transistor MT22is larger than a PS diameter dPS₂₃(dPS₀>dPS₁>dPS_(s)>dPS_(s+1)>dPS₂₂>dPS₂₃) in the memory cell transistorMT23. That is, the PS diameter sequentially becomes smaller from thememory cell transistor MT0 to the memory cell transistor MT23(dPS_(w)>dPS_(x), (w<x); and w and x are integers from 0 to 23).

In addition, the PS diameter dPS₂₄ (dPS₂₄=dPS₂₃) in the memory celltransistor MT24 is smaller than the PS diameter dPS₂₅ (dPS₂₄<dPS₂₅) inthe memory cell transistor MT25. In addition, the PS diameter dPS_(s)(dPS_(s)>dPS₂₅>dPS₂₄) in the memory cell transistor MTt (t is an integerfrom 26 to smaller than 47) is smaller than a PS diameter dPS_(t+1)(dPS_(t+1)>dPS_(t)>dPS₂₅>dPS₂₄) in the memory cell transistor MTt+1. Inaddition, a PS diameter dPS₄₆ (dPS₄₆>dPS_(t+1)>dPS_(t)>dPS₂₅>dPS₂₄) inthe memory cell transistor MT46 is smaller than a PS diameter dPS₄₇(dPS₄₇>dPS₄₆>dPS_(t+1)>dPS_(t)>dPS₂₅>dPS₂₄) in the memory celltransistor MT47. That is, the PS diameter sequentially becomes largerfrom the memory cell transistor MT24 to the memory cell transistor MT47(dPS_(u)<dPS_(v) (u<v); and u and v are integers from 24 to 47).

Hereinafter, for simplification, the memory cell transistors MT0 andMT47 are shown to have the same PS diameter, the memory cell transistorsMTs and MTt are shown to have the same PS diameter, and the memory celltransistors MT23 and MT24 are shown to have the same PS diameter.However, it is not necessary that embodiments are limited to theconfiguration.

The configuration of the memory cell array 111 is disclosed in, forexample, U.S. patent application Ser. No. 12/407,403, filed Mar. 19,2009, the title being “Three Dimensional Stacked NonvolatileSemiconductor Memory”. In addition, the configuration is also disclosedin U.S. patent application Ser. No. 12/406,524, filed Mar. 18, 2009, thetitle being “Three Dimensional Stacked Nonvolatile SemiconductorMemory”; in U.S. patent application Ser. No. 12/679,991, filed Mar. 25,2010, the title being “Non-volatile Semiconductor Storage Device andMethod of Manufacturing the Same”; and in U.S. patent application Ser.No. 12/532,030, filed Mar. 23, 2009, the title being “SemiconductorMemory and Method for Manufacturing Same”. The entire patentapplications are employed by references in the present disclosure.

Regarding Erasing Operation of Data of Seventh Embodiment

Next, an erasing operation of the memory system 1 according to theseventh embodiment will be described with reference to FIGS. 18 to 20.

The basic erasing operation is the same as that of the above-describedfirst embodiment. That is, the sequencer 121 according to the seventhembodiment makes the voltage VSWL larger as the PS diameter is smallerand makes the voltage VSWL smaller as the PS diameter is larger.

As described in FIG. 18, in the NAND strings 114 according to theseventh embodiment, the PS diameter becomes smaller from the word lineWL0 to the word line WL23 and the PS diameter becomes larger from theword line WL24 to the word line WL47.

The sequencer 121 performs an operation the same as that in Step S101according to the above-described first embodiment. A specific operationof the sequencer 121 according to the seventh embodiment will bedescribed with reference to FIGS. 18 to 20.

As illustrated in FIG. 18 and FIG. 19A to FIG. 19C, the PS diameterdiffers in each of the memory cell transistors MT. As described above,the relationship between the PS diameters of the memory cell transistorsMT0, MTs, and MT23 is dPS₀>dPS_(s)>dPS₂₃. The relationship between thePS diameters of the memory cell transistors MT24, MTt, and MT47 isdPS₂₄<dPS_(t)<dPS₄₇.

As illustrated in FIG. 20, the sequencer 121 applies a voltage VSWL_WL0to the word line WL0, applies a voltage VSWL_WLs (VSWL_WL0<VSWL_WLs) tothe word line WLs, and applies a voltage VSWL_WL23(VSWL_WL0<VSWL_WLs<VSWL_WL23) to the word line WL23. In addition, thesequencer 121 applies a voltage VSWL_WL24 to the word line WL24(VSWL_WL23=VSWL_WL24), applies a voltage VSWL_WLt(VSWL_WL24>VSWL_WLt=VSWL_WLs) to the word line WLt, and applies avoltage VSWL_WL47 (VSWL_WL24>VSWL_WLt>VSWL_WL47=VSWL_WL0) to the wordline WL47. The voltage VSWL is applied in accordance with the PSdiameter of the memory cell transistor MT in this manner.

Effect of Seventh Embodiment

As described above, according to the memory system according to theseventh embodiment, similarly to the first embodiment, the sequencer 121makes a voltage VSWL, which is applied to a word line WL of a memorycell transistor MT, larger as the PS diameter of the memory celltransistor MT is smaller. Moreover, the sequencer 121 makes a voltageVSWL, which is applied to a word line WL of a memory cell transistor MT,smaller as the PS diameter of the memory cell transistor MT is larger.

As a result, similarly to the first embodiment, it is possible toprovide a high-quality memory system 1 that may suppress anydeterioration or the like of the memory cell transistors MT.

Modification Example 1 of Seventh Embodiment

It is also possible to apply the memory cell array 111 described in theseventh embodiment to the second embodiment. The basic erasing operationis the same as that described in the second embodiment. However, in StepS204, the sequencer 121 may increase the voltage VSWL of the word linesWL (for example, WL23, WL24, and the like) that belong to memory celltransistors MT (for example, MT23, MT24, and the like) having a small PSdiameter as illustrated in FIG. 21, for example.

Modification Example 2 of Seventh Embodiment

In addition, it is also possible to apply the memory cell array 111described in the seventh embodiment to the third embodiment. The basicerasing operation is the same as that described with reference to FIGS.11A and 11B in the third embodiment. However, in Step S303 illustratedin FIGS. 11A and 11B, the sequencer 121 may increase the voltage VSWL ofthe word lines WL (for example, WL23, WL24, and the like) that belong tomemory cell transistors MT (for example, MT23, MT24, and the like)having a small PS diameter as illustrated in FIG. 22, for example.

Modification Example 3 of Seventh Embodiment

In addition, it is also possible to apply the memory cell array 111described in the seventh embodiment to the fourth embodiment. In thiscase, for example, The word lines WL0 to WL47 are divided into threeareas (zones) as illustrated in FIGS. 23 and 24. In specific, the wordlines WL0 to WL7 and the word lines WL40 to WL47 are set to a zone 0,the word lines WL8 to WL15 and the word lines WL32 to WL39 are set to azone 1, the word lines WL16 to WL23 and the word lines WL24 to WL31 areset to a zone 2. According to the example, it is possible to more easilyperform control than the fourth embodiment since the number of zones isless than the fourth embodiment.

Modification Example 4 of Seventh Embodiment

In addition, it is also possible to apply the memory cell array 111described in the seventh embodiment to the fifth embodiment. In thiscase, as described in FIGS. 23 and 24, it is possible to apply thememory cell array 111 according to the seventh embodiment to the fifthembodiment by defining the zones and the voltage VSWL as illustrated inFIG. 25.

Modification Example 5 of Seventh Embodiment

In addition, it is also possible to apply the memory cell array 111described in the seventh embodiment to the sixth embodiment. In thiscase, as described in FIGS. 23 and 24, it is possible to apply thememory cell array 111 according to the seventh embodiment to the sixthembodiment by defining the zones and the voltage VSWL as illustrated inFIG. 26.

Other Modification Examples

In the above-described embodiments, the sequencer 121 controls anyexcessive erasing in the memory cell transistor MT having a small PSdiameter, by controlling the voltage which is applied to the word linesWL or the bit lines BL. However, it is also possible to obtain theeffect the same as those of the above-described embodiments even bymaking the sequencer 121 shorten the pulse width of the voltage VSWLwith respect to the memory cell transistor MT having a small PS diametercompared to the pulse width of the voltage VSWL with respect to thememory cell transistor MT having a large PS diameter, for example.

In addition, although the above-described first embodiment or the likeis described assuming that the diameter (MH diameter) of the memoryholes and the diameter (PS diameter) of the columnar structure becomesmaller as the extension direction of the memory holes becomes largerdue to the process during the processing of the memory holes,embodiments are not limited thereto.

Furthermore, the configuration of the memory cell array 111 is notlimited to the configuration described in the above-describedembodiments. Embodiments may be widely applied to any storage devicethat varies in the PS diameter of the memory cell transistor MT.Accordingly, the above-described embodiments are not limited to the NANDflash memory 100, and may be overally applied to other storage devices.In addition, each of the embodiments may be either implemented alone orimplemented in combination of plural embodiments which may be combinedto each other.

The erasing operation is performed using GIDL in the above-describedembodiments, but embodiments are not limited to the method. For example,there is a method (that is, a well-erasing method) of applying a voltageof about 20V to the well region 23 of FIG. 6 when erasing data of memorycells in the nonvolatile semiconductor memory of U.S. patent applicationSer. No. 12/407,403, filed Mar. 19, 2009. In this case, for example, thevoltage 20 V to 23 V is applied to the well region 23, the source area24 and the bit line are made to be floating, and the voltages of about15 V and 10 V are respectively applied to the gates of the select gatetransistors SGS and SGD. The voltage applied to the gates of the selectgate transistors SGD is set to be lower than the voltage applied to thegates of the select gate transistors SGS. It is possible to apply thewell-erasing method in each of the embodiments.

In each of the embodiments,

(1) in the read operation,

The voltage which is applied to the selected word line for the readoperation of the “A” level is in the range between 0 V to 0.55 V, forexample. However, the voltage is not limited thereto and may be in anyone of the ranges between 0.1 V to 0.24 V, 0.21 V to 0.31 V, 0.31 V to0.4 V, 0.4 V to 0.5 V, and 0.5 V to 0.55 V.

The voltage which is applied to the selected word line for the readoperation of the “B” level is in the range between 1.5 V to 2.3 V, forexample. However, the voltage is not limited thereto and may be in anyone of the ranges between 1.65 V to 1.8 V, 1.8 V to 1.95 V, 1.95 V to2.1 V, and 2.1 V to 2.3 V.

The voltage which is applied to the selected word line for the readoperation of the “C” level is in the range between 3.0 V to 4.0V, forexample. However, the voltage is not limited thereto and may be in anyone of the ranges between 3.0 V to 3.2 V, 3.2 V to 3.4 V, 3.4 V to 3.5V, 3.5 V to 3.6 V, and 3.6 V to 4.0 V.

The duration (tR) of the read operation may be in the ranges between 25μs to 38 μs, 38 μs to 70 μs, and 70 μs to 80 μs.

(2) The write operation includes the program operation and theverification operation as described above. In the write operation,

the voltage which is first applied to the selected word line during theprogram operation is in the range between 13.7 V to 14.3 V, for example.However, the voltage is not limited thereto and may be in any one of theranges between 13.7 V to 14.0 V, and 14.0 V to 14.6 V, for example.

Moreover, a voltage, which is first applied to the selected word linewhen writing an odd-numbered word line, may be changed to a voltage,which is first applied to the selected word line when writing aneven-numbered word line.

When the program operation is set as an incremental step pulse program(ISPP) method, an example of the step-up voltage includes 0.5 V.

The voltage applied to the non-select word line may be in the rangebetween 6.0 V to 7.3V. The voltage is not limited thereto. For example,the voltage may be in the range between 7.3 V to 8.4 V and may be 6.0 Vor less.

A pass voltage to be applied may be changed according to whether thenon-select word line is the odd-numbered word line or the even-numberedword line.

The duration (tProg) of the write operation may be in the ranges between1,700 μs to 1,800 μs, 1,800 μs to 1,900 μs, and 1,900 μs to 2,000 μs.

(3) In the erasing operation,

the voltage first applied to the well which is formed on thesemiconductor substrate and above which the memory cells are disposed isin the range between 12 V to 13.6V, for example. However, the voltage isnot limited thereto, and may be in the ranges between 13.6 V to 14.8 V,14.8 V to 19.0 V, 19.0 V to 19.8 V, and 19.8 V to 21 V, for example.

The duration (tErase) of the erasing operation may be in the rangesbetween 3,000 μs to 4,000 μs, 4,000 μs to 5,000 μs, and 4,000 μs to9,000 μs.

(4) The structure of the memory cell

The structure of the memory cell includes a charge storage layer whichis disposed on the semiconductor substrate (silicon substrate) through atunnel insulating film having a thickness in the range of 4 nm to 10 nm.The charge storage layer may be made to have a stacked structure with aninsulating film, such as SiN or SiON having a thickness in the range of2 nm to 3 nm, and with polysilicon having a thickness in the range of 3nm to 8 nm. In addition, a metal such as Ru may be added to thepolysilicon. The charge storage layer includes an insulating filmthereon. The insulating film includes a silicon oxide film which has athickness in the range of 4 nm to 10 nm interposed between a lower-layerhigh-k film having a thickness in the range of 3 nm to 10 nm and anupper-layer high-k film having a thickness in the range of 3 nm to 10nm. An example of the high-k film includes HfO. In addition, it ispossible to make the thickness of the silicon oxide film thicker thanthe thickness of the high-k film. A control electrode having a thicknessin the range of 30 nm to 70 nm is formed on the insulating film througha material that is for adjusting work function and has a thickness inthe range of 3 nm to 10 nm. Here, the material for adjusting workfunction is a metal oxide film such as TaO or a metal nitride film suchas TaN. It is possible to use W or the like for the control electrode.

In addition, it is possible to form an air gap between the memory cells.

In addition, in the above-described embodiments, a specificconfiguration of each of the elements, such as a substrate, an electrodefilm, an insulating film, a stacked structure, a storage layer, a chargestorage layer, a semiconductor pillar, a word line, a bit line, a sourceline, a wiring, a memory cell transistor, a select gate transistor, andthe like, that forms the nonvolatile semiconductor memory device, isincluded in the scope of each of the above-described embodiments whenthose skilled in the art may also implement embodiments by appropriatelyselecting the configuration from the well-known scope and may obtain thesame effect.

In addition, a combination of any two or more elements of theabove-described embodiments within a scope, in which embodiments may betechnically implemented, is also included in the scope of theembodiments as long as the combination includes the gist of theembodiments.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A method of erasing memory cells of a nonvolatilesemiconductor memory device that comprises: a memory string having afirst transistor, a second transistor, and a plurality of memory cellsstacked above a semiconductor substrate between the first transistor andthe second transistor, the plurality of memory cells including firstmemory cells, a second memory cell, and a third memory cell, wherein thefirst memory cells are between the second and third memory cells; a bitline electrically connected to a first end of the memory string; asource line electrically connected to a second end of the memory string;first word lines, each electrically connected to a gate of a respectiveone of the first memory cells; a second word line electrically connectedto a gate of the second memory cell; and a third word line electricallyconnected to a gate of the third memory cell, said method comprisingapplying during a first phase of an erase operation, a first voltage tothe first word lines, a second voltage different from the first voltageto the second word line, a third voltage different from the firstvoltage to the third word line, and a fourth voltage to the source line,wherein the first voltage, the second voltage, the third voltage, andthe fourth voltage are each higher than a ground voltage, and the firstvoltage is higher than either the second voltage or the third voltage,and the fourth voltage is higher than any of the first voltage, thesecond voltage, and the third voltage.
 2. The method according to claim1, wherein the nonvolatile semiconductor memory device further comprisesa first gate line electrically connected to a gate of the firsttransistor, and a second gate line electrically connected to a gate ofthe second transistor, said method further comprising during the firstphase, applying a fifth voltage to the first gate line and applying asixth voltage to the second gate line, wherein the fifth voltage and thesixth voltage are each higher than any of the first voltage, the secondvoltage, and the third voltage, and lower than the fourth voltage. 3.The method according to claim 2, wherein the fifth voltage is between 12V and 17 V.
 4. The method according to claim 1, wherein the nonvolatilesemiconductor memory device further comprises a fourth word line, and afifth word line, and the memory cells further includes a fourth memorycell and a fifth memory cell, a gate of the fourth memory cell beingelectrically connected to the fourth word line and a gate of the fifthmemory cell being electrically connected to the fifth word line, saidmethod further comprising: during the first phase, applying the firstvoltage to the fourth word line and applying the second voltage to thefifth word line.
 5. The method according to claim 4, wherein the memorycells further includes a sixth memory cell between the first memorycells and the second memory cell, a gate of the sixth memory cell beingelectrically connected to the sixth word line, said method furthercomprising during the first phase, applying a seventh voltage to thesixth word line, the seventh voltage being lower than either the firstvoltage or the second voltage.
 6. The method according to claim 4,wherein the nonvolatile semiconductor memory device further comprises asixth word line, and the memory cells further includes a sixth memorycell between the first memory cells and the second memory cell, a gateof the sixth memory cell being electrically connected to the sixth wordline, said method further comprising during the first phase, applying aseventh voltage to the sixth word line, the seventh voltage being higherthan either the first voltage or the second voltage.
 7. The methodaccording to claim 1, further comprising: during a second phrase of theerase operation after the first phase, applying an eighth voltage higherthan the fourth voltage to the source line.
 8. The method according toclaim 7, further comprising: during the second phase, applying the firstvoltage to the first word lines and applying the second voltage to thesecond word line and the third word line.
 9. The method according toclaim 7, further comprising: during the second phase, applying a ninthvoltage higher than the first voltage to the first word lines andapplying the second voltage to the second word line and the third wordline.
 10. The method according to claim 7, further comprising: during athird phrase of the erase operation after the second phase, applying atenth voltage higher than the eighth voltage to the source line.
 11. Amethod of erasing memory cells of a nonvolatile semiconductor memorydevice that comprises: a memory string, including a first transistor, asecond transistor, and a plurality of memory cells stacked above asemiconductor substrate and electrically connected in series between thefirst transistor and the second transistor, the plurality of memorycells including first memory cells, a second memory cell, and a thirdmemory cell, wherein the first memory cells are electrically connectedin series between the second and third memory cells; a bit lineelectrically connected to a first end of the memory string; a sourceline electrically connected to a second end of the memory string; firstword lines, each electrically connected to a gate of a respective one ofthe first memory cells; a second word line electrically connected to agate of the second memory cell; and a third word line electricallyconnected to a gate of the third memory cell, said method comprisingapplying during a first phase of an erase operation, a first voltage tothe first word lines, a second voltage different from the first voltageto the second word line, a third voltage different from the firstvoltage to the third word line, and a fourth voltage to the source line,wherein the first voltage, the second voltage, the third voltage, andthe fourth voltage are each higher than a ground voltage, and the firstvoltage is higher than either the second voltage or the third voltage,and the fourth voltage is higher than any of the first voltage, thesecond voltage, and the third voltage.
 12. The method according to claim11, wherein the nonvolatile semiconductor memory device furthercomprises a first gate line electrically connected to a gate of thefirst transistor, and a second gate line electrically connected to agate of the second transistor, said method further comprising during thefirst phase, applying a fifth voltage to the first gate line and a sixthvoltage to the second gate line, wherein the fifth voltage and the sixthvoltage are each higher than any of the first voltage, the secondvoltage, and the third voltage, and lower than the fourth voltage. 13.The method according to claim 12, wherein the fifth voltage is between12 V and 17 V.
 14. The method according to claim 11, wherein thenonvolatile semiconductor memory device further comprises a fourth wordline, and a fifth word line, and the memory cells further includes afourth memory cell and a fifth memory cell, a gate of the fourth memorycell being electrically connected to the fourth word line and a gate ofthe fifth memory cell being electrically connected to the fifth wordline, said method further comprising during the first phase, applyingthe first voltage to the fourth word line and applying the secondvoltage to the fifth word line.
 15. The method according to claim 14,wherein the nonvolatile semiconductor memory device further comprises asixth word line, and the memory cells further includes a sixth memorycell electrically connected between the first memory cells and thesecond memory cell, a gate of the sixth memory cell being electricallyconnected to the sixth word line, said method further comprising duringthe first phase, applying a seventh voltage to the sixth word line, theseventh voltage being lower than either the first voltage or the secondvoltage.
 16. The method according to claim 14, wherein the nonvolatilesemiconductor memory device further comprises a sixth word line, and thememory cells further includes a sixth memory cell between the firstmemory cells and the second memory cell, a gate of the sixth memory cellbeing electrically connected to the sixth word line, said method furthercomprising during the first phase, applying a seventh voltage to thesixth word line, the seventh voltage being higher than either the firstvoltage or the second voltage.
 17. The method according to claim 11,further comprising: during a second phrase of the erase operation afterthe first phase, applying an eighth voltage higher than the fourthvoltage to the source line.
 18. The method according to claim 17,further comprising: during the second phase, applying the first voltageto the first word lines and applying the second voltage to the secondword line and the third word line.
 19. The method according to claim 17,further comprising: during the second phase, applying a ninth voltagehigher than the first voltage to the first word lines and applying thesecond voltage to the second word line and the third word line.
 20. Themethod according to claim 17, further comprising: during a third phraseof the erase operation after the second phase, applying a tenth voltagehigher than the eighth voltage to the source line.